Method for forming a circuit board via structure for high speed signaling

ABSTRACT

One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the PCB, and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a divisional of U.S. patent application Ser. No. 14/010,051,filed Aug. 26, 2013, which is a divisional of U.S. patent applicationSer. No. 13/190,597, filed Jul. 26, 2011, now issued as U.S. Pat. No.8,516,695, which is a continuation of U.S. patent application Ser. No.12/699,428, filed Feb. 3, 2010, issued as U.S. Pat. No. 7,992,297, whichis a divisional of U.S. patent application Ser. No. 11/533,005, filedSep. 19, 2006, issued as U.S. Pat. No. 7,676,919, which is a divisionalof U.S. patent application Ser. No. 11/114,420, filed Apr. 26, 2005(abandoned). Priority is claimed to these applications, and all areincorporated herein by reference in their entireties. Furthermore, thisapplication relates to U.S. Pat. No. 7,459,638, entitled “AbsorbingBoundary for a Multi-Layer Circuit Board Structure,” which isincorporated herein by reference in its entirety.

FIELD OF THE INVENTION

Embodiments of this invention relate to printed circuit boards, and inparticular to an improved via structure for providing signal integrityimprovement.

BACKGROUND

In a multilayer printed circuit board (PCB), there are occasions thatsignals have to switch signaling planes in the PCB. FIGS. 1A and 1Billustrate such signal plane switching. As best shown in the crosssectional view of FIG. 1B, a signal trace 18 t originally proceeding onthe top of a PCB 15 meets with a via 18 appearing through the PCB 15 anddown to another signal trace 18 b on the bottom of the PCB 15. Thus, byuse of the via 18, the signal trace is allowed to change planes in theprinted circuit board, which can facilitate signal routing.

Also present in the PCB 15 are power (i.e., Vdd) and ground planes,respectively numbered as 12, 14, and referred to collectively as “powerplanes.”These power planes 12, 14 allow power and ground to be routed tothe various devices mounted on the board (not shown). (Although shownwith the power plane 14 on top of the ground plane 12, these planes canbe reversed). When routing a signal through these power planes, it isnecessary to space the via 18 from both planes 12, 14, what is referredto as an antipad diameter 12 h, 14 h. The vias themselves at the levelof the signal planes have pads to facilitate routing of the signals 18t, 18 b to the via, which have a pad diameter (18 p) larger than thediameter of the via 18 itself (d). Typical values for the diameter ofthe via (d), the pad diameter (18 p) and the antipad diameter (12 h, 14h) are 16, 20, and 24 mils respectively. It should be understood that anactual PCB 15 might have several different signal and power planes, aswell as more than two signal planes, although not shown for clarity.

When a signal trace such as 18 t, 18 b switches signal planes, thesignal return current—a transient—will generate electromagnetic (EM)waves that propagate in the cavity 17 formed between the power andground planes 12, 14. Such EM waves will cause electrical disturbance onthe signal being switched, as well as other signals traces. Suchdisturbances are especially felt in other near-by signals traces thatare also switching signal planes, such as signal traces 16 t, 16 b (FIG.1A) due to coupling between the vias (i.e., 18 and 16). Moreover, suchEM disturbances are significantly enhanced around the resonantfrequencies of the power/ground cavity 17, which in turn are determinedby the physical dimensions of the power planes 12, 14. Via-to-viacoupling induced by signal plane switching can cause significantcross-talk, and can be particularly problematic for high frequencyswitching applications.

FIGS. 2 and 3, representing computer simulations on the structure ofFIG. 1A, illustrate these problems. In these simulations, one of thesignal lines (say, signal 16) is an “aggressor” through which asimulated signal is passed, and the other signal line (signal 18) is the“victim” whose perturbation is monitored. The simulations were run inHFSS™, which is a full-wave three-dimensional EM solver available fromAnsoft Corporation of Pittsburgh, Pa. The simulations were run assuminga 2.0-by-0.4 inch PCB 15, a spacing of 100 mils between the two vias 16,18, a height of 54 mils between the power planes 12, 14 defining thecavity 17, and use of an FR4 dielectric for the PCB 16 (with adielectric constant of 4.2). Traces 16 t, 16 b, 18 t, and 18 b wereassumed to be microstrip lines with a characteristic impedance of 40ohms. Via diameters, via pad diameters, and antipad diameters wereassumed to have the values mentioned previously.

FIG. 2 shows the transmission coefficient of the aggressor signal, andsignificant signal loss is observed around certain resonant frequencies.The measured parameter is a scattering parameter (S-parameter), which isa standard metric for signal integrity and which is indicative of themagnitude of the EM disturbance caused by signal plane switching. FIG. 3shows the coupling coefficient between the aggressor and victim signals.As can be seen, the coupling coefficient stands close to −10 db aroundall resonance frequencies, indicating significant cross-talk between theaggressor and the victim.

The prior art has sought to remedy these problems in a number ofdifferent ways. First, as disclosed in Houfei Chen et al., “Coupling ofLarge Numbers of Vias in Electronic Packaging Structures andDifferential Signaling,” IEEE MTT-S International Microwave Symposium,Seattle, Wash., Jun. 2-7 (2002), it was taught to surround vias ofinterest in a PCB with shielding vias. In U.S. Pat. No. 6,789,241, itwas taught to place decoupling capacitors between the power and groundplanes on a PCB at different locations. In Thomas Neu, “DesigningControlled Impedance Vias,” at 67-72, EDN (Oct. 2, 2003), it was taughtto minimize the impedance discontinuity caused by the via structure byadding four companion vias, all connected to ground planes. All of thesereferences cited in this paragraph are hereby incorporated by reference.

However, these prior approaches suffer from drawbacks, as will bediscussed in further detail later. In any event, the art would bebenefited from strategies designed to minimize problems associated withsignals switching signal planes in a printed circuit board. Thisdisclosure provides such a solution in the form of an improved, shieldedvia structure.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the inventive aspects of this disclosure will be bestunderstood with reference to the following detailed description, whenread in conjunction with the accompanying drawings, in which:

FIG. 1A illustrates a perspective view of two prior art vias bothswitching signal planes through power and ground planes.

FIG. 1B illustrates a cross section of one of the vias of FIG. 1A.

FIG. 2 illustrates signal loss (via S-parameters) as a function offrequency for both the prior art via of FIG. 1B and the disclosed via ofFIG. 4.

FIG. 3 illustrates via coupling (in dB) as a function of frequency forboth the prior art via of FIG. 1B and the disclosed via of FIG. 4.

FIG. 4 illustrates a cross section of the disclosed improved viastructure.

FIGS. 5A-5N illustrate sequential steps for the construction of the viaof FIG. 4.

DETAILED DESCRIPTION

FIG. 4 shows an improved via structure 50 which alleviates the problemof signals switching signal planes through power planes. As shown, andsimilar to FIG. 1B, a signal 60 switches from the top (60 t) to thebottom (60 b) of the PCB 66 through via 60. Also similarly to FIG. 1B,power and ground planes 62 and 64 are present. However, in distinctionto FIG. 1B, the power and ground planes 62 and 64 are coupled toconcentric cylinders 62 a and 64 a (i.e., shields) around the via 60.Through this configuration, the cylinders 62 a, 64 a substantiallyencompasses the via in directions perpendicular to its axis 61, suchthat the cylinders are positioned in a dielectric perpendicularly to theplane of the PCB 66.

This via structure 50 facilitates signal transitioning from one plane toanother by reducing the disturbances cause by return pathdiscontinuities, particularly at high frequencies. Moreover, the viastructure 50 suppresses via-to-via coupling otherwise caused byresonance between the ground and power planes 62, 64 at highfrequencies, thereby improving signal integrity and reducing cross-talkfrom aggressor signals. The approach provides more efficient viashielding than the use of shielding vias, discussed in the background.Moreover, the disclosed approach performs better at high frequency thando approaches using decoupling capacitors, which otherwise suffer fromrelatively high effective series inductances that exist in decouplingcapacitors, again as discussed in the background. As compared to priorart seeking to minimize the impedance discontinuity caused by the via,also discussed in the background, the disclosed approach is moreflexible and realistic. In that prior art approach, both of the planestransgressed must be held at the same potential (i.e., ground or power).In short, that prior technique has no pertinence when signals have tochange through both power and ground planes, as that technique wouldrequire shorting those planes together, which is not possible in a realworking PCB. In short, it provides no solution for the problem addressedhere of switching through power and ground planes. In short, thedisclosed via structure has improved applicability tohigh-speed/high-frequency PCB designs, where signals have reduced timingand noise margins and increased energies.

The improved performance is shown in FIGS. 2 and 3, which as discussedpreviously shows computer simulation results indicative of the magnitudeof the EM disturbance caused by signal plane switching and cross-talk.Thus, referring again to FIG. 2, it is seen that the disclosed viastructure 50 has an improved transmission coefficient (i.e.,S-parameter), and does not generally suffer large “dips” in thetransmission coefficient resulting from unwanted resonance in the cavitybetween the power planes. Moreover, and referring again to FIG. 3, itcan be seen that cross-talk is greatly minimized, especially at higherfrequencies. As modeled, the core via of FIG. 4 had the same coredimensions and materials of the via of FIG. 1 as discussed in thebackground, and had the following additional parameters: an inner powerdiameter 56 of 20 mils; an inner ground diameter 58 of 23 mils; cylinderwall thicknesses of 2 mils; a 1 mil dielectric thickness 57 between thecylinders; and a 3 mil vertical distance 55 between the top of the powercylinder 64 a and the ground plane 62. (As such, it should be understoodthat the cross section of FIG. 4 is not drawn to scale). Of course,these values for the improved via structure 50 are merely exemplary, andcan be changed depending on the environment in which the vias willoperate. For example, the core via 60 can be made of a smaller diameter,and the cylinders 62 a, 64 a can be further spaced from core via 60.

As shown in FIG. 4, it is preferable to place the power and groundcylinders 62 a, 64 a as close as together to maximize the couplingbetween them. Preferably, the dielectric thickness 57 between thecylinders would not exceed 3 mils for the materials discussed herein.

Although the via structure 50 is shown in FIG. 4 with the power cylinder62 a within the ground cylinder 64 a, it should be understood that thecylinders can be reversed with the same effect, i.e., with the groundcylinder 64 a within the power cylinder 62 a.

Manufacture of the disclosed via structure 50 can take place asillustrated in the sequential cross-sectional views of FIG. 5A-5N. Mostof the individual steps involve common techniques well known in the PCBarts, and so are only briefly discussed. Further information on suchsteps are disclosed in “PCB/Overview” (Apr. 11, 2004), which ispublished at www.ul.ie/˜rinne/ee6471/ee6471%20wk11.pdf, which isincorporated herein by reference in its entirety, and which is submittedwith the Information Disclosure Statement filed with this application.

Starting with FIG. 5A, the starting substrate comprises a dielectriclayer 66 which has been coated on both sides with a conductive material62, 64, which comprises the power and ground planes. In a preferredembodiment, dielectric 66 is FR4, but could comprise any dielectricuseable in a PCB. The conductive materials 62, 64 can also comprisestandard PCB conductive materials.

In FIG. 5B, a hole 70 that will eventually encompass the cylinders isformed. Such a hole 70 can be formed by mechanical or laser drilling.Note that the hole 70 does not proceed through the entirety of thedielectric 66, but instead leaves a thickness akin to the thickness 55(FIG. 4) in the finished via.

In FIG. 5C, the resulting structure is electrically plated to form line71 the hole 70. Processes for electrical plating are well known in theart, and hence are not further discussed. Note that through this processthe plating 71 couples to the ground plane 64. In FIG. 5D, thehorizontal portion of the plating 71 is removed, which can occur usingplasmas or wet chemical etchants. In this regard, it may be useful toemploy a removable masking layer (not shown) over conductors 62, 64 toprotect them against the etch step of FIG. 5D, which would then allow ananisotropic plasma etch to be used to remove only the horizontal portionof the plating 71. The resulting structure defines the outer cylinder 64a.

In FIG. 5E, the hole 70 is filled with another dielectric material 72.This dielectric material can be deposited either by chemical vapordeposition, or “spun on” to the substrate in liquid form and thenhardened. Either way, the bottom side of the substrate might need to beplanarized to remove unwanted portions of the dielectric material 72from the surface of the ground plane 64.

FIGS. 5F-5I essentially mimic the steps of FIGS. 5B-5E (drilling,plating, etching, and dielectric filling), but occur on the top of thesubstrate and are relevant to the formation of the inner cylinder (i.e.,62 a). As these steps are the same, they are not again discussed.

In FIG. 5J, sheets of a dielectric prepreg material 78 are adhered tothe top and bottom of the substrate. The prepreg sheets 78 are heatedand hardened to adhere them to the remaining substrate, which can occurin a hydraulic press. Once adhered, the prepreg forms the dielectricbetween the power planes/associated cylinders and the signal traces, aswill become evident in the following Figures.

In FIG. 5K, a conductive material 80 for the signal traces is formed onboth the top and bottom of the substrate. Again, plating and/or chemicalvapor deposition can be used to form the conductive material 80.

In FIG. 5L, a hole 82 for the via is formed. Such hole may bemechanically drilled or formed by laser drilling.

In FIG. 5M, another conductive material 84 is placed on the sides of thehole 84 to form via 80, e.g., by plating and/or chemical vapordeposition. In so doing, the conductive material 84 contacts the top andbottom conductive material 80 deposited in FIG. 5K.

In FIG. 5N, the conductive material 80 is masked and etched usingstandard PCB techniques to form the necessary conductors on the top andbottom of the substrate. In particular, and as shown, top and bottomconductors 80 t, 80 b are formed, thus forming, in conjunction with thevia 80, a signal which switches signal planes through the power planes,i.e., the problematic configuration discussed above. However, thedual-shield configuration minimizes the effects of EM disturbance.

The disclosed via structure 50 is susceptible to modifications. It ispreferable that the shields 62 a, 64 a are circular and concentric, asthis geometry is easiest to manufacture. However, useful embodiments ofthe invention need not be either circular or concentric. For example,the shields 62 a, 64 a can take the form of squares, rectangles, ovals,etc., and additionally need not be perfectly concentric to achieveimproved performance. The dielectric material (72; FIG. 5E) between thecylinders 62 a, 64 a need not be FR4, but could comprise other highdielectric constant materials other than those mentioned. Finally, thenumber of shields can be increased. Thus, there could be three shields(e.g., with a ground shield nested between two power shields or viceversa), four shield (with alternating power and ground shields), ormore.

Although particularly useful in the context of a printed circuit board,the disclosed technique could also be adapted to the formation ofshielded vias for integrated circuits.

In short, it should be understood that the inventive concepts disclosedherein are capable of many modifications. To the extent suchmodifications fall within the scope of the appended claims and theirequivalents, they are intended to be covered by this patent.

What is claimed is:
 1. A method for forming a via, comprising: forming asecond conductive cylinder within a first conductive cylinder in acircuit board, wherein the first conductive cylinder is coupled to afirst conductive layer in the circuit board, wherein the secondconductive cylinder is coupled to a second conductive layer in thecircuit board, wherein the first and second conductive layers are spacedfrom one another at a spaced distance, and wherein the first cylinderand the second cylinder extend respectively from the first and secondconductive layers toward the other conductive layer, and neither extendsfor the entire spaced distance between the first and second conductivelayers; forming a first dielectric layer on the first conductive layer,and a second dielectric layer on the second conductive layer; forming athird conductive layer on the first dielectric layer, and a fourthconductive layer on the second dielectric layer; and forming a viawithin the second conductive cylinder, wherein the via is coupled to thethird and fourth conductive layers.
 2. The method of claim 1, whereinthe first conductive layer is coupled to one of a power supply voltageor a ground voltage, and wherein the second conductive layer is coupledto the other of the power supply voltage or the ground voltage.
 3. Themethod of claim 1, wherein the first, second, third and fourthconductive layers are parallel.
 4. The method of claim 3, wherein thefirst and second conductive layers are between the third and fourthconductive layers.
 5. The method of claim 1, wherein the first andsecond conductive cylinders are separated by a dielectric.
 6. The methodof claim 1, wherein the first and second conductive cylinders areconcentric with the via.
 7. The method of claim 1, wherein power andground planes are coupled to the first and second conductive cylindersto form a power cylinder and a ground cylinder.
 8. The method of claim7, wherein the power cylinder is formed within the ground cylinder. 9.The method of claim 7, wherein the ground cylinder is formed within thepower cylinder.
 10. The method of claim 7, wherein forming the viacomprises forming the via with a mechanical or laser drill.